IEEE 1101.2 PDF

in by IEEE Std in order to ensure interoperability and common good practices. Thanks to this standard, conduction cooled boards and chassis. Find the most up-to-date version of IEEE at Engineering (This foreword is not a part of IEEE Std , IEEE Standard for Mechanical Core Specifications for Conduction-Cooled Eurocards.) This document.

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An adapter for commercial off-the-shelf COTS circuit card modules resulting in increased cooling efficiency. You may send this item to up to five recipients. As clamping force is increased, the interface conductance is increased, thus increasing the efficiency of heat movement from the component 6 to the cold wall of chassis 2. Write a review Rate this item: Affiliation List of ICS 110.12.

It is contemplated, however, that certain convection-cooled applications would require the use of an extended width wedgelock and thus, it is shown for purposes of illustration. It is contemplated that ieew use of the present invention can involve components having different characteristics as long as the principle is followed, i.

The E-mail Address es you entered is are not in a valid format. In the circuit card module of FIG. Get a quote for certification of systems, products or services, and get certified. The increased wedgelock size idee doubles the clamping force applied.

Advanced Search Find a Library. Obviously VME has been available for 20 years and long life is a key factor for military applications.

Please enter recipient e-mail address es. In contrast, the module illustrated in FIG. The increased wedgelock size approximately doubles the clamping force applied with respect to conventional modules.


CompactPCI on the rise! Low profile high density rack mountable enclosure with superior cooling and highly 11001.2 re-configurable components. This temperature rise is significantly avoided using the adapter of the present invention.

IEEE – January

However, none of these patents disclose or suggest a structure that satisfies the IEEE As described above, the removal of the protrusion 4 allows for an increase in the width of the contact surface between the frame 1 and chassis 2 by from about 0. In particular, the adapter frame structure of the present invention is designed to allow the use of large wedgelocks, e.

Legal notices Photo credits FAQ. The following summary of the invention is provided to facilitate an understanding of some of the innovative features unique to the present invention, and is not intended to be a full description.

US USB1 en The circuit card module of FIG. The system shown in Figure 1 contains up to six 3U VME cards and is capable of withstanding an ambient temperature of to 85 degrees C as well as a large shock and vibration environment.

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In addition, the adapter allows for the use of an extended width wedgelock to increase the clamping force over the conduction contact area. Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus. The increased force, in combination with the additional contacting surface areas, significantly reduces the thermal resistance between the frame and the chassis 2 cold wall.

Please enter the message. Application layer service definition – Type 11 elements IEC 11011.2 Would you also like to submit a review for this item?


Conduction cooled CompactPCI boards ready for insertion

Also, the wedgelock 3 can ieer an extended width wedgelock as described above with respect to FIGS. Title from ieed provider. In accordance with the present invention, existing wedgelocks are increased in width from approximately 0. Wedgelock device for increased thermal conductivity of a printed wiring assembly. In the conduction-cooled configuration, the component heat is removed by conduction to the chassis cold wall.

A commercially-available wedgelock 13 suitable for use in the present invention is the Card-Lok product which can be obtained from Calmark Corp.

Conduction-Cooled PMC (CCPMC)

Accordingly, it is an object of the present invention to 101.2 an adapter for COTS circuit card modules resulting in improved cooling efficiency. Meyer, IV et al. Terms and conditions for Customized compilation of standards Contact us Accessibility.

It is yet a further object of the present invention to increase the conduction contact area between the frame of the circuit card module and the chassis.

Select the first category of products searched and follow the instructions. Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system.

Your request to send this item has been completed. Additionally, for IEEE The embodiment illustrated in FIG.